Chip Resistor

The present invention provides a chip resistor with a small absolute value of a thermal electromotive force and a small absolute value of a resistance temperature coefficient so as to reduce a defect occurrence rate when producing a product even if the chip resistor is designed with a small resistan...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: YUN, JANG SEOK, PARK, KWANG HYUN, BAEK, KYUNG SEON
Format: Patent
Sprache:eng ; kor
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:The present invention provides a chip resistor with a small absolute value of a thermal electromotive force and a small absolute value of a resistance temperature coefficient so as to reduce a defect occurrence rate when producing a product even if the chip resistor is designed with a small resistance value. According to an embodiment of the present invention, the chip resistor comprises: a substrate; first and second electrodes located on one surface of the substrate; and a resistance body located to electrically connect the first electrode and the second electrode, and including a copper-manganese-tin (Cu-Mn-Sn) alloy. The copper-manganese-tin (Cu-Mn-Sn) alloy contains 11% or more to 20% or less of manganese (Mn), 2% or more to 8% or less of tin (Sn), and 13.5% or more to 22.5% or less of manganese-tin (Mn-Sn). 본 발명의 일 실시 예에 따른 칩 저항기는, 기판과, 기판의 일면상에 배치된 제1 및 제2 전극과, 제1 전극과 제2 전극을 전기적으로 연결하도록 배치되고 구리-망간-주석(Cu-Mn-Sn) 합금을 포함하는 저항체를 포함하고, 구리-망간-주석(Cu-Mn-Sn) 합금에서 망간(Mn)의 비율은 11% 이상 20% 이하이고 주석(Sn)의 비율은 2% 이상 8% 이하이고 망간-주석(Mn-Sn)의 비율은 13.5% 이상 22.5% 이하일 수 있다.