WAFER DICING METHOD

A wafer cutting method of the present invention comprises the following steps of: providing a wafer; and performing a cutting step and a pressure contacting step. The wafer has a plurality of dies and a metal layer. The metal layer is formed on a cutting street between the adjacent two dies. The met...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	WEI CHUNG HSIANG, LIAO WEN HSIANG, TU CHIA JUNG, LIU YUNG CHI, CHEN CHIH LUNG
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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