CIRCUIT APPARATUS AND METHOD OF MANUFACTURING THE SAME

Provided is a circuit device which has good heat emitting performance and is additionally small. According to the present invention, in a mixed integrated circuit device (10), a lead (18) and a lead (20) are fixed to an upper surface of a circuit substrate (12). The lead (12) has an island unit (28)...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	HORIUCHI FUMIO, INAGAKI YUHKI, KUDO KIYOAKI, SAKURAI AKIRA, MASHIMO SHIGEAKI
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	Provided is a circuit device which has good heat emitting performance and is additionally small. According to the present invention, in a mixed integrated circuit device (10), a lead (18) and a lead (20) are fixed to an upper surface of a circuit substrate (12). The lead (12) has an island unit (28), a slant unit (30), and a lead unit (32). A transistor (22) and a diode (24) are mounted on an upper surface of the island unit (28). And, an electrode installed on upper surfaces of the transistor (22) and the diode (24) bypasses metallic fine lines (26) to be connected to a bonding unit (34). The bonding unit (34) of the lead (18) is arranged in an upper portion compared to the island unit (28) to separate metallic fine lines (26) bonded to the bonding unit (34). 방열성이 높고 또한 소형인 회로 장치를 제공한다. 본 발명의 혼성 집적 회로 장치(10)에서는, 회로 기판(12)의 상면에 리드(18) 및 리드(20)가 고착되어 있다. 리드(18)는 아일랜드부(28), 경사부(30) 및 리드부(32)를 구비하고 있고, 아일랜드부(28)의 상면에 트랜지스터(22) 및 다이오드(24)가 실장된다. 그리고, 트랜지스터(22) 및 다이오드(24)의 상면에 설치된 전극은 금속 세선(26)을 경유해서 본딩부(34)와 접속된다. 리드(18)의 본딩부(34)는 아일랜드부(28)보다도 상방에 배치됨으로써 본딩부(34)에 접속되는 금속 세선(26)끼리가 이격된다.