A METHOD OF FABRICATING FLEXIBLE PRINTED CIRCUIT BOARDS

A method for producing a flexible circuit board is provided. The method for producing a printed circuit board comprises: providing a base film which has a device mounting region defined on one surface thereof, wherein a stiffener including an opening region formed to correspond to the device mountin...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
1. Verfasser:	SON, DONG EUN
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A method for producing a flexible circuit board is provided. The method for producing a printed circuit board comprises: providing a base film which has a device mounting region defined on one surface thereof, wherein a stiffener including an opening region formed to correspond to the device mounting region is attached to the other surface of the base film; filling a heat radiation material in the opening region to form a heat radiation layer; and removing the stiffener. 연성 회로 기판의 제조 방법이 제공된다. 상기 연성 회로 기판의 제조 방법은, 일면에 소자 실장 영역이 정의된 베이스 필름을 제공하되, 상기 베이스 필름은 상기 소자 실장 영역에 대응하도록 형성된 개구 영역을 포함하는 스티프너가 타면에 부착되고, 상기 개구 영역 내에 방열 물질을 채워 방열층을 형성하고, 상기 스티프너를 제거하는 것을 포함한다.