LIGHT EMITTING DIODE PACKAGE
A light emitting element package is provided. According to an embodiment, the light emitting element package comprises: a light emitting element; a wavelength converting layer configured to cover an upper surface and a side surface of the light emitting element; and a protection layer configured to...
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| Format: | Patent |
| Sprache: | eng ; kor |
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| Zusammenfassung: | A light emitting element package is provided. According to an embodiment, the light emitting element package comprises: a light emitting element; a wavelength converting layer configured to cover an upper surface and a side surface of the light emitting element; and a protection layer configured to cover an upper surface and a side surface of the wavelength converting layer. A thickness of the protection layer is 20 to 120 μm. A sum of thicknesses of the wavelength converting layer and the protection layer is thinner than a thickness of the light emitting element. Therefore, the light emitting element package can prevent a fluorescent substance from being deformed and discolored due to heat.
발광소자 패키지가 제공된다. 일 실시예에 따른 발광소자 패키지는 발광소자; 상기 발광소자의 상부면 및 측면을 덮는 파장변환층; 및 파장변환층의 상부면 및 측면을 덮는 보호층을 포함하고, 상기 보호층의 두께는 20㎛ 내지 120㎛이고, 상기 파장변환층 및 보호층의 두께의 합은 상기 발광소자의 두께보다 작은 것을 특징으로 한다. |
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