Semiconductor die pick-up apparatus

A device for picking up a semiconductor die according to an embodiment of the present invention includes: a stage for supporting a base film on which a semiconductor die is disposed; an ejecting unit for locally applying tension to the base film and forming a groove or a hole in a portion to which t...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: MIN, BOK GYU, LEE, SUK WON, SHIN, JUNG YONG
Format: Patent
Sprache:eng ; kor
Schlagworte:
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