ULTRASOUND TRANSDUCER AND MANUFACTURING METHOD THEREOF

The present invention relates to an ultrasound transducer used in an ultrasound system and a manufacturing method thereof. The ultrasound transducer comprises: a backing block; a piezoelectric layer arranged on the backing block; a matching layer arranged on the piezoelectric layer; and a grounding...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: LEE, SEUNG HEE, KIM, DU YEOP, LEE, KYUNG HO
Format: Patent
Sprache:eng ; kor
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Beschreibung
Zusammenfassung:The present invention relates to an ultrasound transducer used in an ultrasound system and a manufacturing method thereof. The ultrasound transducer comprises: a backing block; a piezoelectric layer arranged on the backing block; a matching layer arranged on the piezoelectric layer; and a grounding layer arranged between the piezoelectric layer and the matching layer. The backing block comprises: a connector to be electrically connected to a transmitting unit and a receiving unit of the ultrasound system; and a wiring area configured to connect the piezoelectric layer to the connector. 초음파 시스템에서 사용되는 초음파 트랜스듀서와 그 제조 방법은 백킹 블록과, 백킹 블록 상에 배치되는 압전층과, 압전층 상에 배치되는 정합층과, 압전층과 정합층 사이에 배치되는 접지층을 포함한다. 백킹 블록은 초음파 시스템의 송신부 및 수신부와 전기적으로 접속하기 위한 커넥터와, 압전층과 커넥터를 연결하는 배선 영역을 포함한다.