METHOD FOR PREPARING THREE-DIMENSIONAL SUBSTRATE

The purpose of the present invention is to provide a method for preparing a three-dimensional substrate in which a pattern is printed in an easy manner using a high thermal resistant composition. A method for preparing a three-dimensional substrate comprises the following steps: (a) processing the o...

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Bibliographische Detailangaben
Hauptverfasser:	JEON JAE SEUNG, JO JONG KAP, HEO JIN NYOUNG, SHIM BYOUNG YUL
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CHEMISTRY GLASS MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES METALLURGY MINERAL OR SLAG WOOL PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	The purpose of the present invention is to provide a method for preparing a three-dimensional substrate in which a pattern is printed in an easy manner using a high thermal resistant composition. A method for preparing a three-dimensional substrate comprises the following steps: (a) processing the outer appearance of a plane substrate; (b) forming a printing layer on one surface of the plane substrate; (c) three-dimensionally molding the plane substrate with heat; (d) reinforcing the three-dimensionally molded substrate with heat; and (e) forming a functional layer on the other surface of the reinforced substrate. 본 발명의 일 실시예에 따른 입체 기재의 제조 방법은 (a) 평면 기재의 외형을 가공하는 단계; (b) 상기 평면 기재의 일면에 인쇄층을 형성하는 단계; (c) 상기 평면 기재를 입체적으로 열성형하는 단계; (d) 상기 입체적으로 열성형된 기재를 강화하는 단계; 및 (e) 상기 강화된 기재의 타면 상에 기능성층을 형성하는 단계를 포함한다.