CUTTING DEVICE

According to the present invention, a cutting device is disclosed. The disclosed cutting device comprises: a bed unit having a plurality of support protrusions which support a material and are formed in an upper portion thereof; a frame unit arranged on an upper side of the bed unit; a firing port u...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: PARK, HONG JUN, JUNG, JONG IL, CHOI, JONG HYUN, CHOI, KWANG HO
Format: Patent
Sprache:eng ; kor
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Beschreibung
Zusammenfassung:According to the present invention, a cutting device is disclosed. The disclosed cutting device comprises: a bed unit having a plurality of support protrusions which support a material and are formed in an upper portion thereof; a frame unit arranged on an upper side of the bed unit; a firing port unit installed in the frame unit, and emitting a flame to the material; and a laser unit installed in the frame unit, and irradiating laser to the material so as to check an arrangement state of the material. 절단장치에 대한 발명이 개시된다. 개시된 절단장치는: 상부에 소재를 받치는 복수개의 받침돌기가 구비되는 베드부와, 베드부의 상측에 배치되는 프레임부와, 프레임부에 설치되며, 소재를 향해 화염을 내뿜는 화구부와, 프레임부에 설치되며, 소재의 배열상태를 확인하기 위해 소재를 향해 레이저를 조사하는 레이저부를 포함하는 것을 특징으로 한다.