FLEXIBLE PRINTED CIRCUIT BOARDS AND METHOD FOR FABRICATING THE SAME
The present invention provides a flexible circuit substrate which includes a heat radiation layer containing a heat radiation material and has an excellent heat radiation property on a protective layer covering a conductive pattern, and a manufacturing method thereof. The flexible circuit substrate...
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| Format: | Patent |
| Sprache: | eng ; kor |
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| Zusammenfassung: | The present invention provides a flexible circuit substrate which includes a heat radiation layer containing a heat radiation material and has an excellent heat radiation property on a protective layer covering a conductive pattern, and a manufacturing method thereof. The flexible circuit substrate comprises: a base film; a plurality of first conductive patterns formed on one surface of the base film; a first protective layer formed to cover the plurality of first conductive patterns; and a first heat radiation layer which is the heat radiation layer covering the first protective layer, wherein the heat radiation layer includes a base material and the heat radiation material included in a base material.
연성 회로 기판 및 그 제조 방법이 제공된다. 연성 회로 기판은, 베이스 필름, 상기 베이스 필름의 일면 상에 형성된 복수의 제1 도전 패턴, 상기 복수의 제1 도전 패턴을 덮도록 형성된 제1 보호층 및 상기 제1 보호층을 덮는 제1 방열층으로, 상기 제1 방열층은 베이스 물질 및 상기 베이스 물질에 포함된 방열재를 포함한다. |
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