CLEANING APPARATUS OF WAFER

The present invention relates to a device for washing a wafer by using isopropyl alcohol (IPA) and, more specifically, to a wafer washing device which can prevent collapse of a pattern due to surface tension of a washing solution by supplying IPA to wash a pattern surface of a wafer while the wafer...

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1. Verfasser:	GIMM, DAE HEE
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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creator	GIMM, DAE HEE
description	The present invention relates to a device for washing a wafer by using isopropyl alcohol (IPA) and, more specifically, to a wafer washing device which can prevent collapse of a pattern due to surface tension of a washing solution by supplying IPA to wash a pattern surface of a wafer while the wafer is preheated by supplying steam. In addition, the device for washing the wafer by supplying IPA to the pattern surface of the wafer comprises: a spin chuck having a supporting board protruding from the top surface thereof to rotate the wafer while supporting the pattern surface of the wafer to face upwards; an IPA supplying means which supplies IPA to the pattern surface of the wafer; and a steam supplying means which supplies steam to the back surface of the pattern surface through a steam spray unit that is placed between the top surface of the spin chuck and the bottom surface of the wafer. 본 발명은 IPA(이소프로필알코올)를 이용한 웨이퍼 세정장치에 관한 것으로서, 보다 상세하게는 웨이퍼에 스팀을 공급하여 예열한 상태에서 웨이퍼의 패턴면에 IPA를 공급하여 세정함으로써 세정액의 표면장력에 의한 패턴의 붕괴를 방지할 수 있는 웨이퍼 세정장치에 관한 것이다. 본 발명은 웨이퍼의 패턴면에 IPA(이소프로필알코올)를 공급하여 세정하는 장치에 있어서, 웨이퍼의 패턴면에 IPA(이소프로필알코올)를 공급하여 세정하는 장치에 있어서, 상면에 지지대가 돌출형성되어 상기 웨이퍼의 패턴면이 상향하도록 지지한 상태에서 회전시키는 스핀척; 상기 웨이퍼의 패턴면에 IPA를 공급하는 IPA공급수단; 및 상기 스핀척의 상면과 웨이퍼의 하면 사이에 구비되는 스팀분사부를 통해 상기 패턴면의 이면에 스팀을 공급하는 스팀공급수단;을 포함한다.
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In addition, the device for washing the wafer by supplying IPA to the pattern surface of the wafer comprises: a spin chuck having a supporting board protruding from the top surface thereof to rotate the wafer while supporting the pattern surface of the wafer to face upwards; an IPA supplying means which supplies IPA to the pattern surface of the wafer; and a steam supplying means which supplies steam to the back surface of the pattern surface through a steam spray unit that is placed between the top surface of the spin chuck and the bottom surface of the wafer. 본 발명은 IPA(이소프로필알코올)를 이용한 웨이퍼 세정장치에 관한 것으로서, 보다 상세하게는 웨이퍼에 스팀을 공급하여 예열한 상태에서 웨이퍼의 패턴면에 IPA를 공급하여 세정함으로써 세정액의 표면장력에 의한 패턴의 붕괴를 방지할 수 있는 웨이퍼 세정장치에 관한 것이다. 본 발명은 웨이퍼의 패턴면에 IPA(이소프로필알코올)를 공급하여 세정하는 장치에 있어서, 웨이퍼의 패턴면에 IPA(이소프로필알코올)를 공급하여 세정하는 장치에 있어서, 상면에 지지대가 돌출형성되어 상기 웨이퍼의 패턴면이 상향하도록 지지한 상태에서 회전시키는 스핀척; 상기 웨이퍼의 패턴면에 IPA를 공급하는 IPA공급수단; 및 상기 스핀척의 상면과 웨이퍼의 하면 사이에 구비되는 스팀분사부를 통해 상기 패턴면의 이면에 스팀을 공급하는 스팀공급수단;을 포함한다.</description><language>eng ; kor</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180117&DB=EPODOC&CC=KR&NR=20180005964A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,778,883,25547,76298</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180117&DB=EPODOC&CC=KR&NR=20180005964A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>GIMM, DAE HEE</creatorcontrib><title>CLEANING APPARATUS OF WAFER</title><description>The present invention relates to a device for washing a wafer by using isopropyl alcohol (IPA) and, more specifically, to a wafer washing device which can prevent collapse of a pattern due to surface tension of a washing solution by supplying IPA to wash a pattern surface of a wafer while the wafer is preheated by supplying steam. In addition, the device for washing the wafer by supplying IPA to the pattern surface of the wafer comprises: a spin chuck having a supporting board protruding from the top surface thereof to rotate the wafer while supporting the pattern surface of the wafer to face upwards; an IPA supplying means which supplies IPA to the pattern surface of the wafer; and a steam supplying means which supplies steam to the back surface of the pattern surface through a steam spray unit that is placed between the top surface of the spin chuck and the bottom surface of the wafer. 본 발명은 IPA(이소프로필알코올)를 이용한 웨이퍼 세정장치에 관한 것으로서, 보다 상세하게는 웨이퍼에 스팀을 공급하여 예열한 상태에서 웨이퍼의 패턴면에 IPA를 공급하여 세정함으로써 세정액의 표면장력에 의한 패턴의 붕괴를 방지할 수 있는 웨이퍼 세정장치에 관한 것이다. 본 발명은 웨이퍼의 패턴면에 IPA(이소프로필알코올)를 공급하여 세정하는 장치에 있어서, 웨이퍼의 패턴면에 IPA(이소프로필알코올)를 공급하여 세정하는 장치에 있어서, 상면에 지지대가 돌출형성되어 상기 웨이퍼의 패턴면이 상향하도록 지지한 상태에서 회전시키는 스핀척; 상기 웨이퍼의 패턴면에 IPA를 공급하는 IPA공급수단; 및 상기 스핀척의 상면과 웨이퍼의 하면 사이에 구비되는 스팀분사부를 통해 상기 패턴면의 이면에 스팀을 공급하는 스팀공급수단;을 포함한다.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2018</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJB29nF19PP0c1dwDAhwDHIMCQ1W8HdTCHd0cw3iYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXx3kFGBoYWBgYGppZmJo7GxKkCAMLnIUA</recordid><startdate>20180117</startdate><enddate>20180117</enddate><creator>GIMM, DAE HEE</creator><scope>EVB</scope></search><sort><creationdate>20180117</creationdate><title>CLEANING APPARATUS OF WAFER</title><author>GIMM, DAE HEE</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20180005964A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; kor</language><creationdate>2018</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>GIMM, DAE HEE</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>GIMM, DAE HEE</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>CLEANING APPARATUS OF WAFER</title><date>2018-01-17</date><risdate>2018</risdate><abstract>The present invention relates to a device for washing a wafer by using isopropyl alcohol (IPA) and, more specifically, to a wafer washing device which can prevent collapse of a pattern due to surface tension of a washing solution by supplying IPA to wash a pattern surface of a wafer while the wafer is preheated by supplying steam. In addition, the device for washing the wafer by supplying IPA to the pattern surface of the wafer comprises: a spin chuck having a supporting board protruding from the top surface thereof to rotate the wafer while supporting the pattern surface of the wafer to face upwards; an IPA supplying means which supplies IPA to the pattern surface of the wafer; and a steam supplying means which supplies steam to the back surface of the pattern surface through a steam spray unit that is placed between the top surface of the spin chuck and the bottom surface of the wafer. 본 발명은 IPA(이소프로필알코올)를 이용한 웨이퍼 세정장치에 관한 것으로서, 보다 상세하게는 웨이퍼에 스팀을 공급하여 예열한 상태에서 웨이퍼의 패턴면에 IPA를 공급하여 세정함으로써 세정액의 표면장력에 의한 패턴의 붕괴를 방지할 수 있는 웨이퍼 세정장치에 관한 것이다. 본 발명은 웨이퍼의 패턴면에 IPA(이소프로필알코올)를 공급하여 세정하는 장치에 있어서, 웨이퍼의 패턴면에 IPA(이소프로필알코올)를 공급하여 세정하는 장치에 있어서, 상면에 지지대가 돌출형성되어 상기 웨이퍼의 패턴면이 상향하도록 지지한 상태에서 회전시키는 스핀척; 상기 웨이퍼의 패턴면에 IPA를 공급하는 IPA공급수단; 및 상기 스핀척의 상면과 웨이퍼의 하면 사이에 구비되는 스팀분사부를 통해 상기 패턴면의 이면에 스팀을 공급하는 스팀공급수단;을 포함한다.</abstract><oa>free_for_read</oa></addata></record>
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title	CLEANING APPARATUS OF WAFER
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