METHOD FOR MANUFACTURING OF PRINTED CIRCUIT BOARD

The present invention relates to a method for manufacturing a printed circuit board. The method comprises: forming a peeling protective film and a metal layer being in close contact with the peeling protective film in an inner layer pad; and protecting the inner layer pad when performing laser proce...

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Bibliographische Detailangaben
Hauptverfasser:	SHIN JAEHO, HEO KYUNG JIN, LEE SEUNGRYEOL, YOU KWANGSUN, JUNG JOONGHYUK, PARK SANG HOON
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	The present invention relates to a method for manufacturing a printed circuit board. The method comprises: forming a peeling protective film and a metal layer being in close contact with the peeling protective film in an inner layer pad; and protecting the inner layer pad when performing laser processing and applying etchant related to cavity processing, thereby improving the reliability of a product. 본 발명은 인쇄회로기판의 제조방법에 관한 것으로서, 내층 패드에 박리용 보호필름 및 박리용 보호필름과 밀착된 메탈층을 형성하여, 캐비티 가공과 관련된 레이저 가공 및 에칭액 적용 시 내층 패드를 보호하여 이후 제품의 신뢰성을 향상시키는 것을 특징으로 한다.