도포 온도가 낮은 핫 멜트 접착제 조성물

본 발명은, 약 15 g/10분 이상 (190℃, 2.16 ㎏)의 용융 유량 및 약 10 중량% 이하의 이중블록 함량을 갖는 약 15 중량% 이상의 제1 스티렌 블록 공중합체를 포함하는, 도포 온도가 낮은 핫 멜트 접착제 조성물을 청구한다. This invention claims low application temperature hot melt adhesive compositions including at least about 15% by weight of a first styrene block copolymer with a mel...

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Bibliographische Detailangaben
Hauptverfasser:	DAVIS KEVIN P, ROSKA TIMOTHY W, VAUGHAN STEVEN R, KROLL MARK S, MANSOUR AMEARA S, MALCOLM DAVID B
Format:	Patent
Sprache:	kor
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMICAL ASPECTS OF BANDAGES, DRESSINGS, ABSORBENT PADS, ORSURGICAL ARTICLES CHEMISTRY DISINFECTION, STERILISATION, OR DEODORISATION OF AIR DYES HUMAN NECESSITIES HYGIENE MATERIALS FOR BANDAGES, DRESSINGS, ABSORBENT PADS, OR SURGICALARTICLES MEDICAL OR VETERINARY SCIENCE METALLURGY METHODS OR APPARATUS FOR STERILISING MATERIALS OR OBJECTS INGENERAL MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	본 발명은, 약 15 g/10분 이상 (190℃, 2.16 ㎏)의 용융 유량 및 약 10 중량% 이하의 이중블록 함량을 갖는 약 15 중량% 이상의 제1 스티렌 블록 공중합체를 포함하는, 도포 온도가 낮은 핫 멜트 접착제 조성물을 청구한다. This invention claims low application temperature hot melt adhesive compositions including at least about 15% by weight of a first styrene block copolymer with a melt flow rate of at least about 15 g/10 minutes (190° C., 2.16 kgs) and a diblock content of no greater than about 10% by weight.