PROBE CARD MODULE
The present invention discloses a probe card module which can achieve an electrical performance test required to upgrade an integrated circuit manufacturing technology with minimum costs. The probe card module comprises: a plurality of conductive probes; a printed circuit board having a non-circular...
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| creator | LEE TSUNG JUN LAI HUNG WEI |
| description | The present invention discloses a probe card module which can achieve an electrical performance test required to upgrade an integrated circuit manufacturing technology with minimum costs. The probe card module comprises: a plurality of conductive probes; a printed circuit board having a non-circular upper surface and a lower surface, and including a conductive wire connected to the conductive probe; a probe fixing holder installed in a lower part of the lower surface of the printed circuit board to fix the conducive probe; and a plurality of circuit chips installed in an upper part of the upper surface of the printed circuit board.
본 발명은, 프로브 카드 모듈을 개시하며, 이는, 복수의 도전성 프로브; 비원형(non-circular)인 상면과 하면을 구비하고, 상기 도전성 프로브에 연결되는 도전성 와이어를 포함하는 인쇄회로기판; 상기 인쇄회로기판의 하면의 하방에 설치되어, 상기 도전성 프로브를 고정시키기 위한 프로브 고정홀더; 및 상기 인쇄회로기판의 상면의 상방에 설치되는 복수의 회로 칩을 포함한다. |
| format | Patent |
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본 발명은, 프로브 카드 모듈을 개시하며, 이는, 복수의 도전성 프로브; 비원형(non-circular)인 상면과 하면을 구비하고, 상기 도전성 프로브에 연결되는 도전성 와이어를 포함하는 인쇄회로기판; 상기 인쇄회로기판의 하면의 하방에 설치되어, 상기 도전성 프로브를 고정시키기 위한 프로브 고정홀더; 및 상기 인쇄회로기판의 상면의 상방에 설치되는 복수의 회로 칩을 포함한다.</description><language>eng ; kor</language><subject>MEASURING ; MEASURING ELECTRIC VARIABLES ; MEASURING MAGNETIC VARIABLES ; PHYSICS ; TESTING</subject><creationdate>2017</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20171122&DB=EPODOC&CC=KR&NR=20170128071A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20171122&DB=EPODOC&CC=KR&NR=20170128071A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LEE TSUNG JUN</creatorcontrib><creatorcontrib>LAI HUNG WEI</creatorcontrib><title>PROBE CARD MODULE</title><description>The present invention discloses a probe card module which can achieve an electrical performance test required to upgrade an integrated circuit manufacturing technology with minimum costs. The probe card module comprises: a plurality of conductive probes; a printed circuit board having a non-circular upper surface and a lower surface, and including a conductive wire connected to the conductive probe; a probe fixing holder installed in a lower part of the lower surface of the printed circuit board to fix the conducive probe; and a plurality of circuit chips installed in an upper part of the upper surface of the printed circuit board.
본 발명은, 프로브 카드 모듈을 개시하며, 이는, 복수의 도전성 프로브; 비원형(non-circular)인 상면과 하면을 구비하고, 상기 도전성 프로브에 연결되는 도전성 와이어를 포함하는 인쇄회로기판; 상기 인쇄회로기판의 하면의 하방에 설치되어, 상기 도전성 프로브를 고정시키기 위한 프로브 고정홀더; 및 상기 인쇄회로기판의 상면의 상방에 설치되는 복수의 회로 칩을 포함한다.</description><subject>MEASURING</subject><subject>MEASURING ELECTRIC VARIABLES</subject><subject>MEASURING MAGNETIC VARIABLES</subject><subject>PHYSICS</subject><subject>TESTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2017</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBAMCPJ3clVwdgxyUfD1dwn1ceVhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfHeQUYGhuYGhkYWBuaGjsbEqQIAf7AeZg</recordid><startdate>20171122</startdate><enddate>20171122</enddate><creator>LEE TSUNG JUN</creator><creator>LAI HUNG WEI</creator><scope>EVB</scope></search><sort><creationdate>20171122</creationdate><title>PROBE CARD MODULE</title><author>LEE TSUNG JUN ; LAI HUNG WEI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20170128071A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; kor</language><creationdate>2017</creationdate><topic>MEASURING</topic><topic>MEASURING ELECTRIC VARIABLES</topic><topic>MEASURING MAGNETIC VARIABLES</topic><topic>PHYSICS</topic><topic>TESTING</topic><toplevel>online_resources</toplevel><creatorcontrib>LEE TSUNG JUN</creatorcontrib><creatorcontrib>LAI HUNG WEI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LEE TSUNG JUN</au><au>LAI HUNG WEI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>PROBE CARD MODULE</title><date>2017-11-22</date><risdate>2017</risdate><abstract>The present invention discloses a probe card module which can achieve an electrical performance test required to upgrade an integrated circuit manufacturing technology with minimum costs. The probe card module comprises: a plurality of conductive probes; a printed circuit board having a non-circular upper surface and a lower surface, and including a conductive wire connected to the conductive probe; a probe fixing holder installed in a lower part of the lower surface of the printed circuit board to fix the conducive probe; and a plurality of circuit chips installed in an upper part of the upper surface of the printed circuit board.
본 발명은, 프로브 카드 모듈을 개시하며, 이는, 복수의 도전성 프로브; 비원형(non-circular)인 상면과 하면을 구비하고, 상기 도전성 프로브에 연결되는 도전성 와이어를 포함하는 인쇄회로기판; 상기 인쇄회로기판의 하면의 하방에 설치되어, 상기 도전성 프로브를 고정시키기 위한 프로브 고정홀더; 및 상기 인쇄회로기판의 상면의 상방에 설치되는 복수의 회로 칩을 포함한다.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS TESTING |
| title | PROBE CARD MODULE |
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