PROBE CARD MODULE

The present invention discloses a probe card module which can achieve an electrical performance test required to upgrade an integrated circuit manufacturing technology with minimum costs. The probe card module comprises: a plurality of conductive probes; a printed circuit board having a non-circular...

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Hauptverfasser: LEE TSUNG JUN, LAI HUNG WEI
Format: Patent
Sprache:eng ; kor
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Beschreibung
Zusammenfassung:The present invention discloses a probe card module which can achieve an electrical performance test required to upgrade an integrated circuit manufacturing technology with minimum costs. The probe card module comprises: a plurality of conductive probes; a printed circuit board having a non-circular upper surface and a lower surface, and including a conductive wire connected to the conductive probe; a probe fixing holder installed in a lower part of the lower surface of the printed circuit board to fix the conducive probe; and a plurality of circuit chips installed in an upper part of the upper surface of the printed circuit board. 본 발명은, 프로브 카드 모듈을 개시하며, 이는, 복수의 도전성 프로브; 비원형(non-circular)인 상면과 하면을 구비하고, 상기 도전성 프로브에 연결되는 도전성 와이어를 포함하는 인쇄회로기판; 상기 인쇄회로기판의 하면의 하방에 설치되어, 상기 도전성 프로브를 고정시키기 위한 프로브 고정홀더; 및 상기 인쇄회로기판의 상면의 상방에 설치되는 복수의 회로 칩을 포함한다.