SUBSTRATE PROCESSING SYSTEM

The present invention relates to a substrate processing system. The substrate processing system includes a polishing part for performing a chemical mechanical polishing (CMP) process on the substrate, and a cleaning part which includes a plurality of cleaning units for performing cleaning individual...

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Bibliographische Detailangaben
Hauptverfasser:	AN, JOON HO, KWEON, YOUNG KYU
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION ORPROCESSING OF GOODS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE TRANSPORTING
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Beschreibung
Zusammenfassung:	The present invention relates to a substrate processing system. The substrate processing system includes a polishing part for performing a chemical mechanical polishing (CMP) process on the substrate, and a cleaning part which includes a plurality of cleaning units for performing cleaning individually on the substrate on which the polishing process is completed. So, it is possible to reduce the footprint of the cleaning part and improve space efficiency. 본 발명은 기판 처리 시스템에 관한 것으로, 기판 처리 시스템은, 기판에 대해 화학 기계적 연마(CMP) 공정을 수행하는 연마 파트와, 상하 방향을 따라 적층되게 배치되며 연마 공정이 완료된 기판에 대한 세정을 개별적으로 수행하는 복수개의 세정유닛을 구비하는 세정 파트를 포함하여 구성됨으로써, 세정 파트의 풋프린트(footprint)를 저감시키고, 공간효율성을 향상시키는 유리한 효과를 얻을 수 있다.