Film formed board and manufacturing process thereof
The present invention relates to a board panel in which a transfer printing layer is formed from a transfer printing film formed by applying an adhesive layer to the lowermost portion, and a method of manufacturing the same. A transfer printing film or a high gloss transfer printing film, in which a...
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| creator | LEE, SOL MIN |
| description | The present invention relates to a board panel in which a transfer printing layer is formed from a transfer printing film formed by applying an adhesive layer to the lowermost portion, and a method of manufacturing the same. A transfer printing film or a high gloss transfer printing film, in which an adhesive layer is formed on the lowermost layer and a transfer printing layer is laminated on the upper side, is attached on one surface of a board panel of various materials used as an interior finishing material for a building so as to be transferred and printed. It is possible to greatly increase the productivity of the board panel by increasing the production speed of the board panel in which the transfer printing layer is transferred and printed by remarkably reducing time for the adhering process and printing process of the transfer printing film adhering on the board panel of various materials to be transferred and printed. The adhesive layer forming process of the transfer printing film is applied to the environment-friendly rotary copper plate applying process so that an operator can form an environment-friendly manufacturing environment for the work space.
본 발명은 접착제층이 최하부에 도포되어 형성된 전사인쇄필름으로 전사인쇄층을 형성한 보드 패널 및 그 제조방법에 관한 것으로, 최하부층에 접착제층이 형성되고 그 상부로 전사인쇄층이 적층된 전사 인쇄필름 또는 하이그로시 전사인쇄필름을 건축물의 내장용 마감재로 사용되는 다양한 재질의 보드 패널의 일면 상으로 부착하여 전사인쇄되도록 하여, 다양한 재질의 보드 패널 상에 부착되어 전사인쇄되는 전사인쇄필름의 부착 공정 및 인쇄 공정 시간을 획기적으로 단축하여 전사인쇄층이 전사인쇄되는 보드 패널의 생산속도를 높여 보드 패널의 생산성을 크게 증대하고, 전사인쇄필름의 접착제층 형성공정을 친환경적인 회전 동판 도포공정으로 적용하여 작업자에게 작업공간을 친환경적인 제조환경으로 조성할 수 있는 접착제층이 최하부에 도포 형성된 전사인쇄필름으로 전사인쇄층을 형성한 보드 패널 및 그 제조방법에 관한 것이다. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_KR20170124240A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>KR20170124240A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_KR20170124240A3</originalsourceid><addsrcrecordid>eNrjZDB2y8zJVUjLL8pNTVFIyk8sSlFIzEtRyE3MK01LTC4pLcrMS1coKMpPTi0uVijJSC1KzU_jYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXx3kFGBobmBoZGJkYmBo7GxKkCAKiRLUQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Film formed board and manufacturing process thereof</title><source>esp@cenet</source><creator>LEE, SOL MIN</creator><creatorcontrib>LEE, SOL MIN</creatorcontrib><description>The present invention relates to a board panel in which a transfer printing layer is formed from a transfer printing film formed by applying an adhesive layer to the lowermost portion, and a method of manufacturing the same. A transfer printing film or a high gloss transfer printing film, in which an adhesive layer is formed on the lowermost layer and a transfer printing layer is laminated on the upper side, is attached on one surface of a board panel of various materials used as an interior finishing material for a building so as to be transferred and printed. It is possible to greatly increase the productivity of the board panel by increasing the production speed of the board panel in which the transfer printing layer is transferred and printed by remarkably reducing time for the adhering process and printing process of the transfer printing film adhering on the board panel of various materials to be transferred and printed. The adhesive layer forming process of the transfer printing film is applied to the environment-friendly rotary copper plate applying process so that an operator can form an environment-friendly manufacturing environment for the work space.
본 발명은 접착제층이 최하부에 도포되어 형성된 전사인쇄필름으로 전사인쇄층을 형성한 보드 패널 및 그 제조방법에 관한 것으로, 최하부층에 접착제층이 형성되고 그 상부로 전사인쇄층이 적층된 전사 인쇄필름 또는 하이그로시 전사인쇄필름을 건축물의 내장용 마감재로 사용되는 다양한 재질의 보드 패널의 일면 상으로 부착하여 전사인쇄되도록 하여, 다양한 재질의 보드 패널 상에 부착되어 전사인쇄되는 전사인쇄필름의 부착 공정 및 인쇄 공정 시간을 획기적으로 단축하여 전사인쇄층이 전사인쇄되는 보드 패널의 생산속도를 높여 보드 패널의 생산성을 크게 증대하고, 전사인쇄필름의 접착제층 형성공정을 친환경적인 회전 동판 도포공정으로 적용하여 작업자에게 작업공간을 친환경적인 제조환경으로 조성할 수 있는 접착제층이 최하부에 도포 형성된 전사인쇄필름으로 전사인쇄층을 형성한 보드 패널 및 그 제조방법에 관한 것이다.</description><language>eng ; kor</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; BUILDING ; BUILDING MATERIALS ; CHEMISTRY ; COLOUR PRINTING ; DYES ; FIXED CONSTRUCTIONS ; LAYERED PRODUCTS ; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM ; LINING MACHINES ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; PAINTS ; PERFORMING OPERATIONS ; POLISHES ; PRINTING ; PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES ; STAMPS ; STRUCTURAL ELEMENTS ; TRANSPORTING ; TYPEWRITERS ; USE OF MATERIALS AS ADHESIVES</subject><creationdate>2017</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20171110&DB=EPODOC&CC=KR&NR=20170124240A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20171110&DB=EPODOC&CC=KR&NR=20170124240A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LEE, SOL MIN</creatorcontrib><title>Film formed board and manufacturing process thereof</title><description>The present invention relates to a board panel in which a transfer printing layer is formed from a transfer printing film formed by applying an adhesive layer to the lowermost portion, and a method of manufacturing the same. A transfer printing film or a high gloss transfer printing film, in which an adhesive layer is formed on the lowermost layer and a transfer printing layer is laminated on the upper side, is attached on one surface of a board panel of various materials used as an interior finishing material for a building so as to be transferred and printed. It is possible to greatly increase the productivity of the board panel by increasing the production speed of the board panel in which the transfer printing layer is transferred and printed by remarkably reducing time for the adhering process and printing process of the transfer printing film adhering on the board panel of various materials to be transferred and printed. The adhesive layer forming process of the transfer printing film is applied to the environment-friendly rotary copper plate applying process so that an operator can form an environment-friendly manufacturing environment for the work space.
본 발명은 접착제층이 최하부에 도포되어 형성된 전사인쇄필름으로 전사인쇄층을 형성한 보드 패널 및 그 제조방법에 관한 것으로, 최하부층에 접착제층이 형성되고 그 상부로 전사인쇄층이 적층된 전사 인쇄필름 또는 하이그로시 전사인쇄필름을 건축물의 내장용 마감재로 사용되는 다양한 재질의 보드 패널의 일면 상으로 부착하여 전사인쇄되도록 하여, 다양한 재질의 보드 패널 상에 부착되어 전사인쇄되는 전사인쇄필름의 부착 공정 및 인쇄 공정 시간을 획기적으로 단축하여 전사인쇄층이 전사인쇄되는 보드 패널의 생산속도를 높여 보드 패널의 생산성을 크게 증대하고, 전사인쇄필름의 접착제층 형성공정을 친환경적인 회전 동판 도포공정으로 적용하여 작업자에게 작업공간을 친환경적인 제조환경으로 조성할 수 있는 접착제층이 최하부에 도포 형성된 전사인쇄필름으로 전사인쇄층을 형성한 보드 패널 및 그 제조방법에 관한 것이다.</description><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</subject><subject>ADHESIVES</subject><subject>BUILDING</subject><subject>BUILDING MATERIALS</subject><subject>CHEMISTRY</subject><subject>COLOUR PRINTING</subject><subject>DYES</subject><subject>FIXED CONSTRUCTIONS</subject><subject>LAYERED PRODUCTS</subject><subject>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</subject><subject>LINING MACHINES</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</subject><subject>PAINTS</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHES</subject><subject>PRINTING</subject><subject>PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES</subject><subject>STAMPS</subject><subject>STRUCTURAL ELEMENTS</subject><subject>TRANSPORTING</subject><subject>TYPEWRITERS</subject><subject>USE OF MATERIALS AS ADHESIVES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2017</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDB2y8zJVUjLL8pNTVFIyk8sSlFIzEtRyE3MK01LTC4pLcrMS1coKMpPTi0uVijJSC1KzU_jYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXx3kFGBobmBoZGJkYmBo7GxKkCAKiRLUQ</recordid><startdate>20171110</startdate><enddate>20171110</enddate><creator>LEE, SOL MIN</creator><scope>EVB</scope></search><sort><creationdate>20171110</creationdate><title>Film formed board and manufacturing process thereof</title><author>LEE, SOL MIN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20170124240A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; kor</language><creationdate>2017</creationdate><topic>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</topic><topic>ADHESIVES</topic><topic>BUILDING</topic><topic>BUILDING MATERIALS</topic><topic>CHEMISTRY</topic><topic>COLOUR PRINTING</topic><topic>DYES</topic><topic>FIXED CONSTRUCTIONS</topic><topic>LAYERED PRODUCTS</topic><topic>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</topic><topic>LINING MACHINES</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</topic><topic>PAINTS</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHES</topic><topic>PRINTING</topic><topic>PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES</topic><topic>STAMPS</topic><topic>STRUCTURAL ELEMENTS</topic><topic>TRANSPORTING</topic><topic>TYPEWRITERS</topic><topic>USE OF MATERIALS AS ADHESIVES</topic><toplevel>online_resources</toplevel><creatorcontrib>LEE, SOL MIN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LEE, SOL MIN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Film formed board and manufacturing process thereof</title><date>2017-11-10</date><risdate>2017</risdate><abstract>The present invention relates to a board panel in which a transfer printing layer is formed from a transfer printing film formed by applying an adhesive layer to the lowermost portion, and a method of manufacturing the same. A transfer printing film or a high gloss transfer printing film, in which an adhesive layer is formed on the lowermost layer and a transfer printing layer is laminated on the upper side, is attached on one surface of a board panel of various materials used as an interior finishing material for a building so as to be transferred and printed. It is possible to greatly increase the productivity of the board panel by increasing the production speed of the board panel in which the transfer printing layer is transferred and printed by remarkably reducing time for the adhering process and printing process of the transfer printing film adhering on the board panel of various materials to be transferred and printed. The adhesive layer forming process of the transfer printing film is applied to the environment-friendly rotary copper plate applying process so that an operator can form an environment-friendly manufacturing environment for the work space.
본 발명은 접착제층이 최하부에 도포되어 형성된 전사인쇄필름으로 전사인쇄층을 형성한 보드 패널 및 그 제조방법에 관한 것으로, 최하부층에 접착제층이 형성되고 그 상부로 전사인쇄층이 적층된 전사 인쇄필름 또는 하이그로시 전사인쇄필름을 건축물의 내장용 마감재로 사용되는 다양한 재질의 보드 패널의 일면 상으로 부착하여 전사인쇄되도록 하여, 다양한 재질의 보드 패널 상에 부착되어 전사인쇄되는 전사인쇄필름의 부착 공정 및 인쇄 공정 시간을 획기적으로 단축하여 전사인쇄층이 전사인쇄되는 보드 패널의 생산속도를 높여 보드 패널의 생산성을 크게 증대하고, 전사인쇄필름의 접착제층 형성공정을 친환경적인 회전 동판 도포공정으로 적용하여 작업자에게 작업공간을 친환경적인 제조환경으로 조성할 수 있는 접착제층이 최하부에 도포 형성된 전사인쇄필름으로 전사인쇄층을 형성한 보드 패널 및 그 제조방법에 관한 것이다.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BUILDING BUILDING MATERIALS CHEMISTRY COLOUR PRINTING DYES FIXED CONSTRUCTIONS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM LINING MACHINES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PERFORMING OPERATIONS POLISHES PRINTING PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES STAMPS STRUCTURAL ELEMENTS TRANSPORTING TYPEWRITERS USE OF MATERIALS AS ADHESIVES |
| title | Film formed board and manufacturing process thereof |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-06T01%3A03%3A24IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=LEE,%20SOL%20MIN&rft.date=2017-11-10&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EKR20170124240A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |