RECESSED CHIP SCALE PACKAGING LIGHT EMITTING DEVICE AND MANUFACTURING METHOD OF THE SAME

본 발명은 LED 반도체 다이 및 패키지 구조를 포함하는 칩 스케일 패키지(CSP) LED 디바이스에 관한 것이다. 본 발명의 LED 반도체 다이는 패키지 구조에 의해 밀봉되고 패키지 구조의 하면은 밑에 매입된 공간을 포함한다. 또한 CSP LED 디바이스의 제조 방법에 관한 것이다. PROBLEM TO BE SOLVED: To provide a CSP LED element which can be easily and reliably bonded to a submount substrate or other application substrates, and a method of manufacturing the same.SOLUTION: A CSP LED element 1A includes an LED semiconductor die 10 and a packaging structure 20. The LED semiconductor die is a flip-chip LED semiconductor die having an upper surface 11, a lower surface 12 substantially in parallel to but opposite to the upper surface, an edge surface 13, and a set of electrodes 14. The edge surface is formed and extends between the outer rim of the upper surface and that of the lower surface, and the set of electrodes is disposed on the lower surface of the LED semiconductor die. The packaging structure is disposed on the LED semiconductor die to cover the upper surface and edge surface thereof, and includes an upper resin member 30 and a lower resin member 40. The lower resin member covers the upper surface and edge surface of the LED semiconductor die, and the upper resin member is disposed and stacked on the lower resin member. A bottom surface of the packaging structure is upwardly warped to form a recessed space underneath.SELECTED DRAWING: Figure 1A