METHOD OF ELECTROPLATING COPPER INTO A VIA ON A SUBSTRATE FROM AN ACID COPPER ELECTROPLATING BATH

A copper electroplating bath containing an ethylene oxide/propylene oxide random copolymer having a predetermined HLB range and a primary alcohol alkoxilate block copolymer is appropriate to fill a via with copper. A copper deposit actually does not have a void and a surface defect. 특정 HLB 범위를 갖는 에틸...

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Hauptverfasser:	COREY CIULLO, MATTHEW THORSETH, MARK SCALISI
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS CHEMISTRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SEMICONDUCTOR DEVICES
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