METHOD OF ELECTROPLATING COPPER INTO A VIA ON A SUBSTRATE FROM AN ACID COPPER ELECTROPLATING BATH

A copper electroplating bath containing an ethylene oxide/propylene oxide random copolymer having a predetermined HLB range and a primary alcohol alkoxilate block copolymer is appropriate to fill a via with copper. A copper deposit actually does not have a void and a surface defect. 특정 HLB 범위를 갖는 에틸...

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Hauptverfasser:	COREY CIULLO, MATTHEW THORSETH, MARK SCALISI
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS CHEMISTRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SEMICONDUCTOR DEVICES
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Zusammenfassung:	A copper electroplating bath containing an ethylene oxide/propylene oxide random copolymer having a predetermined HLB range and a primary alcohol alkoxilate block copolymer is appropriate to fill a via with copper. A copper deposit actually does not have a void and a surface defect. 특정 HLB 범위를 갖는 에틸렌 옥사이드/프로필렌 옥사이드 랜덤 공중합체 및 1차 알코올 알콕실레이트 블록 공중합체를 함유하는 구리 전기도금 조는 비아를 구리로 충전하는 데 적합하고, 이러한 구리 침착물은 실질적으로 보이드가 없고 실질적으로 표면 결함이 없다.