Image sensor package
Disclosed is an image sensor package capable of realizing miniaturization. The image sensor package comprises: an image sensor inserted into an installation groove formed on a substrate; an optical glass installed on the substrate to be spaced apart from an upper surface of the substrate; and a mold...
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| Format: | Patent |
| Sprache: | eng ; kor |
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| Zusammenfassung: | Disclosed is an image sensor package capable of realizing miniaturization. The image sensor package comprises: an image sensor inserted into an installation groove formed on a substrate; an optical glass installed on the substrate to be spaced apart from an upper surface of the substrate; and a molding layer laminated to embed a side surface of the optical glass.
기판에 형성되는 설치홈에 이미지 센서가 삽입 배치되며, 광학유리가 기판의 상면으로부터 이격 배치되도록 기판 상에 설치되며, 광학유리의 측면을 매립하도록 적층되는 몰딩층을 구비하는 이미지 센서 패키지가 개시된다. |
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