SPUTTERING APPARATUSES AND A METHOD OF FORMING MAGNETIC MEMORY DEVICES USING THE SAME

A sputtering apparatus includes a process chamber in which a sputtering process is performed, a substrate holder provided in the process chamber and fixing a horizontal position of a substrate during the sputtering process, and a first sputter gun provided to be vertically spaced apart from the subs...

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Bibliographische Detailangaben

Hauptverfasser:	LEE, JOON MYOUNG, KIM, WOO JIN
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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