LIGHT EMITTING DIODE PACKAGE AND MANUFACTURING METHOD OF THE SAME

The present invention relates to a light emitting diode package and a manufacturing method thereof. The light emitting diode package according to the present invention comprises: a substrate; a first lead which is formed on one side of the substrate; a second lead which is disposed to be separated f...

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Bibliographische Detailangaben
1. Verfasser:	NEI MASAMI
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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