Method of cleaning a substrate and fabrication method of semiconductor device using the same

The present invention relates to a cleaning method of a substrate, comprising: a step of supplying a substrate including a metal material film; a step of performing physical cleaning for the substrate; a step of performing chemical cleaning for the substrate; and a step of drying the surface of the...

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Bibliographische Detailangaben
Hauptverfasser:	PARK, MI HYUN, KIM, SEOK HOON, OH, JUNG MIN, JEONG, JI HOON, LEE, HYO SAN, KIM, KYOUNG SEOB, KIM, KYOUNG HWAN, KIM, IN GI
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES BASIC ELECTRIC ELEMENTS CANDLES CHEMISTRY DETERGENT COMPOSITIONS DETERGENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FATTY ACIDS THEREFROM METALLURGY RECOVERY OF GLYCEROL RESIN SOAPS SEMICONDUCTOR DEVICES SOAP OR SOAP-MAKING USE OF SINGLE SUBSTANCES AS DETERGENTS
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Beschreibung
Zusammenfassung:	The present invention relates to a cleaning method of a substrate, comprising: a step of supplying a substrate including a metal material film; a step of performing physical cleaning for the substrate; a step of performing chemical cleaning for the substrate; and a step of drying the surface of the substrate. By using the cleaning method of the present invention, particles of any size ranges can be effectively removed and a damage to features formed on the substrate can be minimized. 본 발명은 기판의 세정 방법에 관한 것으로서, 금속 물질막을 포함하는 기판을 제공하는 단계; 상기 기판에 대하여 물리적 세정을 수행하는 단계; 상기 기판에 대하여 화학적 세정을 수행하는 단계; 및 상기 기판의 표면을 건조시키는 단계를 포함하는 기판의 세정 방법을 제공한다. 본 발명의 세정 방법을 이용하면 모든 크기 범위의 파티클들을 효과적으로 제거할 수 있으며, 기판 상에 형성된 피처들의 손상이 최소화될 수 있다.