ENCAPSULATED COMPOSITE BACKING PLATE

복합재로 형성된 코어 구성요소와, 금속 또는 금속 합금으로 이루어지고, 코어 구성요소를 완전히 에워싸고 커버하는 외층을 포함하고, 스퍼터링 타겟과 함께 사용하기 위한 백킹 플레이트(backing plate)가 개시된다. 상기한 백킹 플레이트의 재활용 방법도 또한 개시된다. A backing plate for use with a sputtering target is disclosed including a core component formed of a composite material and an outer layer formed o...

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Bibliographische Detailangaben
Hauptverfasser:	KIM JAEYEON, ALBAUGH KEVIN B
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS SOLDERING OR UNSOLDERING SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	복합재로 형성된 코어 구성요소와, 금속 또는 금속 합금으로 이루어지고, 코어 구성요소를 완전히 에워싸고 커버하는 외층을 포함하고, 스퍼터링 타겟과 함께 사용하기 위한 백킹 플레이트(backing plate)가 개시된다. 상기한 백킹 플레이트의 재활용 방법도 또한 개시된다. A backing plate for use with a sputtering target is disclosed including a core component formed of a composite material and an outer layer formed of a metal or metal alloy, wherein the outer layer completely surrounds and covers said core component. A method for recycling such a backing plate is also disclosed.