ADHESIVE COMPOSITION FOR UV-CROSSLINKABLE INTERFACE AND SURFACE MODIFICATION METHOD OF SUBSTRATE USING THEREOF

The present invention relates to an adhesion promoting composition capable of improving adhesion between two interfaces through thermal cross-linking and photo cross-linking between a substrate and a resin, and between resins in an optical device process and an electronic device process, and a produ...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	LEE, HYUNG JONG, LEE, JONG HWI, SEO, YUN JUNG, BAEK, NAM SEOB, JEONG, JIN KWON
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS CORRECTING FLUIDS DYES FILLING PASTES GLASS INKS JOINING GLASS TO GLASS OR OTHER MATERIALS METALLURGY MINERAL OR SLAG WOOL MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS SURFACE TREATMENT OF GLASS USE OF MATERIALS AS ADHESIVES USE OF MATERIALS THEREFOR WOODSTAINS
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Beschreibung
Zusammenfassung:	The present invention relates to an adhesion promoting composition capable of improving adhesion between two interfaces through thermal cross-linking and photo cross-linking between a substrate and a resin, and between resins in an optical device process and an electronic device process, and a production method thereof and, more specifically, to an adhesion promoting composition for making interfaces between the substrate and a photo-curable resin adhere, and to an interface adhesion method using the same. 본 발명은 광학소자 및 전자소자 공정 시 기판과 레진, 레진과 레진의 열가교 및 광가교를 통한 두 계면 간의 접착력을 향상시킬 수 있는 접착 증진 조성물 및 이의 제조방법에 관한 것이다. 구체적으로, 기판과 광경화형 레진간의 계면을 접착시키기 위한 접착 증진 조성물 및 이를 이용한 계면 접착방법에 관한 것이다.