PROTECTIVE MEMBRANE FORMING FILM
보호막의 강도가 높고, 보호막 부착 칩의 생산성 향상에 기여하고, 고신뢰성의 보호막 부착 칩을 얻을 수 있는 보호막 형성용 필름을 제공한다. 본 발명에 관련된 보호막 형성용 필름은 반도체 칩을 보호하는 보호막을 형성하기 위한 보호막 형성용 필름으로서, 에폭시기를 갖는 축합 고리형 방향족 화합물을 포함하는 에폭시계 열경화성 성분을 함유한다. Provided is a protective membrane forming film that has high strength of the protective membrane, contributes...
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| creator | SAEKI NAOYA INAO YOUICHI |
| description | 보호막의 강도가 높고, 보호막 부착 칩의 생산성 향상에 기여하고, 고신뢰성의 보호막 부착 칩을 얻을 수 있는 보호막 형성용 필름을 제공한다. 본 발명에 관련된 보호막 형성용 필름은 반도체 칩을 보호하는 보호막을 형성하기 위한 보호막 형성용 필름으로서, 에폭시기를 갖는 축합 고리형 방향족 화합물을 포함하는 에폭시계 열경화성 성분을 함유한다.
Provided is a protective membrane forming film that has high strength of the protective membrane, contributes to an increase in production characteristics for a chip provided with a protective membrane, and can obtain a highly reliable chip provided with a protective membrane. The protective membrane forming film is for forming a protective membrane that protects a semiconductor chip, and contains an epoxy-based heat-curable component containing a condensed ring aromatic compound having an epoxy group. |
| format | Patent |
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Provided is a protective membrane forming film that has high strength of the protective membrane, contributes to an increase in production characteristics for a chip provided with a protective membrane, and can obtain a highly reliable chip provided with a protective membrane. The protective membrane forming film is for forming a protective membrane that protects a semiconductor chip, and contains an epoxy-based heat-curable component containing a condensed ring aromatic compound having an epoxy group.</description><language>eng ; kor</language><subject>BASIC ELECTRIC ELEMENTS ; CHEMISTRY ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; HETEROCYCLIC COMPOUNDS ; METALLURGY ; ORGANIC CHEMISTRY ; SEMICONDUCTOR DEVICES</subject><creationdate>2017</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20170315&DB=EPODOC&CC=KR&NR=20170029417A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20170315&DB=EPODOC&CC=KR&NR=20170029417A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SAEKI NAOYA</creatorcontrib><creatorcontrib>INAO YOUICHI</creatorcontrib><title>PROTECTIVE MEMBRANE FORMING FILM</title><description>보호막의 강도가 높고, 보호막 부착 칩의 생산성 향상에 기여하고, 고신뢰성의 보호막 부착 칩을 얻을 수 있는 보호막 형성용 필름을 제공한다. 본 발명에 관련된 보호막 형성용 필름은 반도체 칩을 보호하는 보호막을 형성하기 위한 보호막 형성용 필름으로서, 에폭시기를 갖는 축합 고리형 방향족 화합물을 포함하는 에폭시계 열경화성 성분을 함유한다.
Provided is a protective membrane forming film that has high strength of the protective membrane, contributes to an increase in production characteristics for a chip provided with a protective membrane, and can obtain a highly reliable chip provided with a protective membrane. The protective membrane forming film is for forming a protective membrane that protects a semiconductor chip, and contains an epoxy-based heat-curable component containing a condensed ring aromatic compound having an epoxy group.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMISTRY</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>HETEROCYCLIC COMPOUNDS</subject><subject>METALLURGY</subject><subject>ORGANIC CHEMISTRY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2017</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFAICPIPcXUO8QxzVfB19XUKcvRzVXDzD_L19HNXcPP08eVhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfHeQUYGhuYGBkaWJobmjsbEqQIAgdciyw</recordid><startdate>20170315</startdate><enddate>20170315</enddate><creator>SAEKI NAOYA</creator><creator>INAO YOUICHI</creator><scope>EVB</scope></search><sort><creationdate>20170315</creationdate><title>PROTECTIVE MEMBRANE FORMING FILM</title><author>SAEKI NAOYA ; INAO YOUICHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20170029417A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; kor</language><creationdate>2017</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMISTRY</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>HETEROCYCLIC COMPOUNDS</topic><topic>METALLURGY</topic><topic>ORGANIC CHEMISTRY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>SAEKI NAOYA</creatorcontrib><creatorcontrib>INAO YOUICHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SAEKI NAOYA</au><au>INAO YOUICHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>PROTECTIVE MEMBRANE FORMING FILM</title><date>2017-03-15</date><risdate>2017</risdate><abstract>보호막의 강도가 높고, 보호막 부착 칩의 생산성 향상에 기여하고, 고신뢰성의 보호막 부착 칩을 얻을 수 있는 보호막 형성용 필름을 제공한다. 본 발명에 관련된 보호막 형성용 필름은 반도체 칩을 보호하는 보호막을 형성하기 위한 보호막 형성용 필름으로서, 에폭시기를 갖는 축합 고리형 방향족 화합물을 포함하는 에폭시계 열경화성 성분을 함유한다.
Provided is a protective membrane forming film that has high strength of the protective membrane, contributes to an increase in production characteristics for a chip provided with a protective membrane, and can obtain a highly reliable chip provided with a protective membrane. The protective membrane forming film is for forming a protective membrane that protects a semiconductor chip, and contains an epoxy-based heat-curable component containing a condensed ring aromatic compound having an epoxy group.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CHEMISTRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HETEROCYCLIC COMPOUNDS METALLURGY ORGANIC CHEMISTRY SEMICONDUCTOR DEVICES |
| title | PROTECTIVE MEMBRANE FORMING FILM |
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