METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD

The present invention relates to a method for manufacturing a circuit substrate. According to the present invention, a first copper foil is formed on a surface of a first insulation layer based on a predetermined circuit pattern, or is formed under the first insulation layer by using an ETS method....

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KO, YOUNG JOO, LEE, MIN WOO
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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