SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

A substrate is maintained in a horizontal position and rotated by a rotation maintaining device. A coating solution is supplied to a surface of the substrate rotated by the rotation maintaining device by a coating solution supply system. Before the coating solution supplied by the coating solution s...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	TAWARATANI YOSHINORI, FURUKAWA MASAAKI, KANAOKA MASASHI, IMAMURA MASANORI, SAGAWA HIDETOSHI
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A substrate is maintained in a horizontal position and rotated by a rotation maintaining device. A coating solution is supplied to a surface of the substrate rotated by the rotation maintaining device by a coating solution supply system. Before the coating solution supplied by the coating solution supply system loses liquidity, a first removal solution is supplied to a first annular region in the periphery of the substrate rotated by the rotation maintaining device by a first removal solution supply system. In this state, a supply position of the first removal solution by the first removal solution supply system is moved from an inner edge to an outer edge of the first annular region. Accordingly, the present invention can reduce the amount of coating solutions to be used without non-uniformity of a film thickness, non-uniformity of coating, and a lack of coating. 회전 유지 장치에 의해 수평 자세로 기판이 유지되고, 회전된다. 회전 유지 장치에 의해 회전되는 기판의 피처리면에 도포액 공급계에 의해 도포액이 공급된다. 도포액 공급계에 의해 공급된 도포액이 유동성을 상실하기 전에, 회전 유지 장치에 의해 회전되는 기판의 주연부에 있어서의 제1의 환상 영역에 제1의 제거액 공급계에 의해 제1의 제거액이 공급된다. 이 상태에서, 제1의 환상 영역의 내측 가장자리로부터 외측 가장자리로 제1의 제거액 공급계에 의한 제1의 제거액의 공급 위치가 이동된다.