Anisotropic conductive material electronic device including anisotropic conductive material and method of manufacturing electronic device

Disclosed are an anisotropic conductive material, an electronic device including an anisotropic conductive material, and a method for manufacturing the same. The disclosed anisotropic conductive material may include a plurality of particles provided in a matrix material layer. At least some of the p...

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Bibliographische Detailangaben
Hauptverfasser:	CHUNG, CHAN MOON, CHU, KUN MO, CHANG, WON SUK
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CABLES CHEMISTRY CONDUCTORS DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INSULATORS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	Disclosed are an anisotropic conductive material, an electronic device including an anisotropic conductive material, and a method for manufacturing the same. The disclosed anisotropic conductive material may include a plurality of particles provided in a matrix material layer. At least some of the plurality of particles may include a core portion and a shell portion surrounding the core portion. The core portion may include a conductive material that is in a liquid state at a room temperature to approximately 110 degrees Celsius or less. For example, the core portion may include at least one of liquid metal, low-melting solder, and nanofiller. The shell portion may include an insulating material. A bonding portion formed by the use of the anisotropic conductive material may include the core portion drawn out from the particles and may further include an intermetallic compound. 이방성 도전 재료와 이방성 도전 재료를 포함하는 전자소자 및 그 제조방법에 관해 개시되어 있다. 개시된 이방성 도전 재료는 매트릭스 물질층 내에 구비된 복수의 입자를 포함할 수 있다. 상기 복수의 입자의 적어도 일부는 코어부 및 이를 감싸는 껍질부를 포함할 수 있다. 상기 코어부는 상온 내지 약 110℃ 이하의 온도에서 액체 상태인 도전성 물질을 포함할 수 있다. 예컨대, 상기 코어부는 액체 금속, 저융점 솔더, 나노필러(nanofiller) 중 적어도 하나를 포함할 수 있다. 상기 껍질부는 절연성 물질을 포함할 수 있다. 상기 이방성 도전 재료를 이용해서 형성된 접합부는 상기 입자에서 유출된 코어부를 포함할 수 있고, 금속간 화합물을 더 포함할 수 있다.