LEAD FRAME AND MANUFACTURING METHOD THEREOF
The present invention relates to a lead frame and a manufacturing method thereof, capable of providing a surface of a terminal for wire bonding, which is different from that of an external connection terminal. In lead frames (50, 51) formed of a metal plate, at least a part of the back surface is ex...
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| Format: | Patent |
| Sprache: | eng ; kor |
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| Zusammenfassung: | The present invention relates to a lead frame and a manufacturing method thereof, capable of providing a surface of a terminal for wire bonding, which is different from that of an external connection terminal. In lead frames (50, 51) formed of a metal plate, at least a part of the back surface is exposed as the external connection terminal and a semiconductor device is mounted on the surface so that the lead frames can be used as a part of a surface-mounted semiconductor package. A coating layer (30) for bonding with the semiconductor device is formed on the surface and side of the lead frames, and a film (40) is bonded to the back surface.
본 발명은, 와이어 본딩용 단자의 표면을 외부 접속용 단자와 상이한 표면으로 할 수 있는 리드 프레임 및 그 제조 방법을 제공하는 것을 목적으로 한다. 이면의 적어도 일부가 외부 접속 단자로서 노출되고 표면에 반도체 소자가 실장되어 표면 실장형 반도체 패키지의 부품으로서 이용될 수 있는 금속판으로 형성되는 리드 프레임(50, 51)으로서, 상기 반도체 소자와의 본딩이 가능한 본딩용 도금층(30)이 상기 표면과 측면에 형성되고, 필름(40)이 상기 이면에 접착되어 있다. |
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