Electronic Component Package
The present invention includes a core part and an electronic device. Especially, the core part includes first and second resin layers and a reinforcing layer arranged therebetween. The first and second resin layers have different thicknesses from each other. When the temperature is changed, the pres...
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| Hauptverfasser: | , , |
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| Format: | Patent |
| Sprache: | eng ; kor |
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| Zusammenfassung: | The present invention includes a core part and an electronic device. Especially, the core part includes first and second resin layers and a reinforcing layer arranged therebetween. The first and second resin layers have different thicknesses from each other. When the temperature is changed, the present invention provides alleviated bending properties.
본 발명의 일 측면은 코어부 및 전자소자를 포함하며, 특히, 상기 코어부는 제1 및 제2 수지층과, 이들 사이에 배치된 보강층을 포함하되 상기 제1 및 제2 수지층의 두께가 서로 상이한 구조를 갖는다. |
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