ABRASIVE AND POLISHING SLURRY COMPOSITION COMPRISING THE SAME

The present invention relates to polishing particles, and to a polishing slurry composition comprising the same. According to a first aspect of the present invention, polishing particles have elasticity and brittleness. When the polishing particles collide with the surface of an object to be polishe...

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Bibliographische Detailangaben
1. Verfasser:	YOON, YOUNG LOK
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GRINDING MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS PERFORMING OPERATIONS POLISHES POLISHING SEMICONDUCTOR DEVICES TOOLS FOR GRINDING, BUFFING, OR SHARPENING TRANSPORTING
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Beschreibung
Zusammenfassung:	The present invention relates to polishing particles, and to a polishing slurry composition comprising the same. According to a first aspect of the present invention, polishing particles have elasticity and brittleness. When the polishing particles collide with the surface of an object to be polished during polishing the object using the polishing particles and the polishing slurry composition of the present invention, the impact caused from the collision is absorbed and alleviated by the elasticity of the polishing particles. Thus, the polishing particles and the polishing slurry composition prevent the formation of defects on the surface such as scratch, dishing, erosion, corrosion, and the like. 본 발명은 연마입자 및 그를 포함하는 연마 슬러리 조성물에 관한 것으로서, 본 발명의 제1 측면에 따른 연마입자는, 탄성 및 취성을 가진다. 본 발명의 연마입자 및 그를 포함하는 연마 슬러리 조성물에 의하여, 연마 시 연마입자가 연마 대상막의 표면에 충돌했을 때, 충돌에 의해 생긴 충격을 연마입자의 탄성에 의해 흡수 및 완화하여 연마 대상막에 스크래치, 디싱, 에로젼, 부식 등의 표면 결함의 형성을 방지할 수 있다.