APPARATUS FOR SOLDERING A SUBSTRATE

The substrate soldering apparatus includes a process container, a substrate transfer unit, and an ultrasonic generation part. The process container is filled with a solder solution. The substrate transfer unit moves the substrate into the process container to apply the solder solution to the substra...

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Bibliographische Detailangaben
1. Verfasser:	SONG, JIN HUN
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	The substrate soldering apparatus includes a process container, a substrate transfer unit, and an ultrasonic generation part. The process container is filled with a solder solution. The substrate transfer unit moves the substrate into the process container to apply the solder solution to the substrate. The ultrasonic wave generation part is installed in the process container so as to be immersed in the solder solution, and provides ultrasonic vibration to the solder solution while the solder solution is applied to the substrate. So, an oxide layer removing process and a flux applying process can be removed. 기판 솔더링 장치는 프로세스 용기, 기판 이송부 및 초음파 발생부를 포함한다. 상기 프로세스 용기에는 솔더액이 채워진다. 상기 기판 이송부는 기판에 상기 솔더액이 도포되도록 상기 기판을 상기 프로세스 용기의 내부로 이동시킨다. 상기 초음파 발생부는 상기 프로세스 용기의 내부에서 상기 솔더액에 담가지도록 설치되며, 상기 기판에 상기 솔더액이 도포되는 동안 상기 솔더액에 초음파 진동을 제공한다.