METAL MATERIAL FOR ELECTRONIC COMPONENTS AND METHOD FOR PRODUCING SAME

저삽입 발출성, 저위스커성 및 고내구성을 갖는 전자 부품용 금속 재료 및 그 제조 방법을 제공한다. 기재 (11) 와, 기재 (11) 의 최표층을 구성하고, Sn, In 또는 이들 합금으로 형성된 A 층 (14) 과, 기재 (11) 와 A 층 (14) 사이에 형성되어 중층을 구성하고, Ag, Au, Pt, Pd, Ru, Rh, Os, Ir 또는 이들 합금으로 형성된 B 층 (13) 을 구비하고, 최표층 (A 층) (14) 의 두께가 0.002 ∼ 0.2 ㎛ 이고, 중층 (B 층) (13) 의 두께가 0.001 ∼ 0.3 ㎛ 인 전자...

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Hauptverfasser:	KODAMA ATSUSHI, SHIBUYA YOSHITAKA, FUKAMACHI KAZUHIKO
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	ALLOYS APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS CABLES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL CONDUCTORS CURRENT COLLECTORS DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FERROUS OR NON-FERROUS ALLOYS GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL INSULATORS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM LINE CONNECTORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PERFORMING OPERATIONS PRINTED CIRCUITS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS
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Zusammenfassung:	저삽입 발출성, 저위스커성 및 고내구성을 갖는 전자 부품용 금속 재료 및 그 제조 방법을 제공한다. 기재 (11) 와, 기재 (11) 의 최표층을 구성하고, Sn, In 또는 이들 합금으로 형성된 A 층 (14) 과, 기재 (11) 와 A 층 (14) 사이에 형성되어 중층을 구성하고, Ag, Au, Pt, Pd, Ru, Rh, Os, Ir 또는 이들 합금으로 형성된 B 층 (13) 을 구비하고, 최표층 (A 층) (14) 의 두께가 0.002 ∼ 0.2 ㎛ 이고, 중층 (B 층) (13) 의 두께가 0.001 ∼ 0.3 ㎛ 인 전자 부품용 금속 재료 (10).