Electrode for electroplating

The present invention relates to an electroplating electrode, which prevents arc from being generated due to foreign substances by improving adhesion performance and improves electrode efficiency by expanding a current carrying area. The electroplating electrode has: a base board receiving a current...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	KIM, MUN SEOP
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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