Apparatus for transferring semiconductor package

Provided is an apparatus for transferring a semiconductor package. The apparatus for transferring a semiconductor package may include a main body, a pocket unit formed on the main body and containing the semiconductor package, and an attaching preventive unit disposed in the rear of the main body. T...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	JUNG, YONG JIN, JEONG, HYECK JIN, KIM, HEUI SEOG, PARK, YONG KI
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS SEMICONDUCTOR DEVICES TESTING
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	Provided is an apparatus for transferring a semiconductor package. The apparatus for transferring a semiconductor package may include a main body, a pocket unit formed on the main body and containing the semiconductor package, and an attaching preventive unit disposed in the rear of the main body. Thereby, the present invention can prevent the semiconductor package from being attached. 반도체 패키지 이송 장치를 제공한다. 반도체 패키지 이송 장치는, 본체, 본체에 형성되며 반도체 패키지를 수납하는 포켓부 및 본체의 배면에 배치되는 부착 방지부를 포함할 수 있다.