TOUCH PANEL AND FABRICATION METHOD THEREOF

Provided are a touch panel and fabrication method thereof, capable of reducing a fabrication yield of the touch panel. A micro-light emitting diode (micro-LED) display device includes a micro-LED and a substrate. The substrate has at least one first metal layer. The micro-LED includes a light emitti...

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Hauptverfasser: ZHUANYUAN ZHANG, YALU LIN, YUNCONG SU, YAN LIN, TSUNG KE CHIU
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Sprache:eng ; kor
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YALU LIN
YUNCONG SU
YAN LIN
TSUNG KE CHIU
description Provided are a touch panel and fabrication method thereof, capable of reducing a fabrication yield of the touch panel. A micro-light emitting diode (micro-LED) display device includes a micro-LED and a substrate. The substrate has at least one first metal layer. The micro-LED includes a light emitting structure, at least one second metal layer, at least one reflective layer, and a dielectric layer having an opening. The second metal layer forms a eutectic system or soldering contact with the first metal layer. The reflective layer is disposed between the light emitting structure and the second metal layer, and a eutectic point of the eutectic system or soldering point is lower than a melting point of the reflective layer. The dielectric layer is disposed between the light emitting layer and the reflective layer. 마이크로-발광 다이오드(마이크로-LED) 디스플레이 장치는 마이크로-LED 및 기판을 포함한다. 상기 기판은 적어도 하나의 제 1 금속층을 갖는다. 상기 마이크로-LED는 발광 구조체, 적어도 하나의 제 2 금속층, 적어도 하나의 반사층, 및 개구부를 갖는 유전체층(dielectric layer)을 포함한다. 상기 제 2 금속층은 상기 제 1 금속층과 공융계(eutectic system) 또는 납땜 접촉을 형성한다. 상기 반사층은 상기 발광 구조체 및 상기 제 2 금속층 사이에 배치되며, 상기 공융계 또는 납땜 지점의 공융 지점(eutectic point)은 반사층의 녹는점보다 낮다. 유전체층은 상기 발광층 및 반사층 사이에 배치된다.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_KR20160113027A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>KR20160113027A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_KR20160113027A3</originalsourceid><addsrcrecordid>eNrjZNAK8Q919lAIcPRz9VFw9HNRcHN0CvJ0dgzx9PdT8HUN8fB3UQjxcA1y9XfjYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXx3kFGBoZmBoaGxgZG5o7GxKkCAMN3JTE</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>TOUCH PANEL AND FABRICATION METHOD THEREOF</title><source>esp@cenet</source><creator>ZHUANYUAN ZHANG ; YALU LIN ; YUNCONG SU ; YAN LIN ; TSUNG KE CHIU</creator><creatorcontrib>ZHUANYUAN ZHANG ; YALU LIN ; YUNCONG SU ; YAN LIN ; TSUNG KE CHIU</creatorcontrib><description>Provided are a touch panel and fabrication method thereof, capable of reducing a fabrication yield of the touch panel. A micro-light emitting diode (micro-LED) display device includes a micro-LED and a substrate. The substrate has at least one first metal layer. The micro-LED includes a light emitting structure, at least one second metal layer, at least one reflective layer, and a dielectric layer having an opening. The second metal layer forms a eutectic system or soldering contact with the first metal layer. The reflective layer is disposed between the light emitting structure and the second metal layer, and a eutectic point of the eutectic system or soldering point is lower than a melting point of the reflective layer. The dielectric layer is disposed between the light emitting layer and the reflective layer. 마이크로-발광 다이오드(마이크로-LED) 디스플레이 장치는 마이크로-LED 및 기판을 포함한다. 상기 기판은 적어도 하나의 제 1 금속층을 갖는다. 상기 마이크로-LED는 발광 구조체, 적어도 하나의 제 2 금속층, 적어도 하나의 반사층, 및 개구부를 갖는 유전체층(dielectric layer)을 포함한다. 상기 제 2 금속층은 상기 제 1 금속층과 공융계(eutectic system) 또는 납땜 접촉을 형성한다. 상기 반사층은 상기 발광 구조체 및 상기 제 2 금속층 사이에 배치되며, 상기 공융계 또는 납땜 지점의 공융 지점(eutectic point)은 반사층의 녹는점보다 낮다. 유전체층은 상기 발광층 및 반사층 사이에 배치된다.</description><language>eng ; kor</language><subject>CALCULATING ; COMPUTING ; COUNTING ; ELECTRIC DIGITAL DATA PROCESSING ; PHYSICS</subject><creationdate>2016</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20160928&amp;DB=EPODOC&amp;CC=KR&amp;NR=20160113027A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76516</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20160928&amp;DB=EPODOC&amp;CC=KR&amp;NR=20160113027A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ZHUANYUAN ZHANG</creatorcontrib><creatorcontrib>YALU LIN</creatorcontrib><creatorcontrib>YUNCONG SU</creatorcontrib><creatorcontrib>YAN LIN</creatorcontrib><creatorcontrib>TSUNG KE CHIU</creatorcontrib><title>TOUCH PANEL AND FABRICATION METHOD THEREOF</title><description>Provided are a touch panel and fabrication method thereof, capable of reducing a fabrication yield of the touch panel. A micro-light emitting diode (micro-LED) display device includes a micro-LED and a substrate. The substrate has at least one first metal layer. The micro-LED includes a light emitting structure, at least one second metal layer, at least one reflective layer, and a dielectric layer having an opening. The second metal layer forms a eutectic system or soldering contact with the first metal layer. The reflective layer is disposed between the light emitting structure and the second metal layer, and a eutectic point of the eutectic system or soldering point is lower than a melting point of the reflective layer. The dielectric layer is disposed between the light emitting layer and the reflective layer. 마이크로-발광 다이오드(마이크로-LED) 디스플레이 장치는 마이크로-LED 및 기판을 포함한다. 상기 기판은 적어도 하나의 제 1 금속층을 갖는다. 상기 마이크로-LED는 발광 구조체, 적어도 하나의 제 2 금속층, 적어도 하나의 반사층, 및 개구부를 갖는 유전체층(dielectric layer)을 포함한다. 상기 제 2 금속층은 상기 제 1 금속층과 공융계(eutectic system) 또는 납땜 접촉을 형성한다. 상기 반사층은 상기 발광 구조체 및 상기 제 2 금속층 사이에 배치되며, 상기 공융계 또는 납땜 지점의 공융 지점(eutectic point)은 반사층의 녹는점보다 낮다. 유전체층은 상기 발광층 및 반사층 사이에 배치된다.</description><subject>CALCULATING</subject><subject>COMPUTING</subject><subject>COUNTING</subject><subject>ELECTRIC DIGITAL DATA PROCESSING</subject><subject>PHYSICS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2016</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNAK8Q919lAIcPRz9VFw9HNRcHN0CvJ0dgzx9PdT8HUN8fB3UQjxcA1y9XfjYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXx3kFGBoZmBoaGxgZG5o7GxKkCAMN3JTE</recordid><startdate>20160928</startdate><enddate>20160928</enddate><creator>ZHUANYUAN ZHANG</creator><creator>YALU LIN</creator><creator>YUNCONG SU</creator><creator>YAN LIN</creator><creator>TSUNG KE CHIU</creator><scope>EVB</scope></search><sort><creationdate>20160928</creationdate><title>TOUCH PANEL AND FABRICATION METHOD THEREOF</title><author>ZHUANYUAN ZHANG ; YALU LIN ; YUNCONG SU ; YAN LIN ; TSUNG KE CHIU</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20160113027A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; kor</language><creationdate>2016</creationdate><topic>CALCULATING</topic><topic>COMPUTING</topic><topic>COUNTING</topic><topic>ELECTRIC DIGITAL DATA PROCESSING</topic><topic>PHYSICS</topic><toplevel>online_resources</toplevel><creatorcontrib>ZHUANYUAN ZHANG</creatorcontrib><creatorcontrib>YALU LIN</creatorcontrib><creatorcontrib>YUNCONG SU</creatorcontrib><creatorcontrib>YAN LIN</creatorcontrib><creatorcontrib>TSUNG KE CHIU</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ZHUANYUAN ZHANG</au><au>YALU LIN</au><au>YUNCONG SU</au><au>YAN LIN</au><au>TSUNG KE CHIU</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>TOUCH PANEL AND FABRICATION METHOD THEREOF</title><date>2016-09-28</date><risdate>2016</risdate><abstract>Provided are a touch panel and fabrication method thereof, capable of reducing a fabrication yield of the touch panel. A micro-light emitting diode (micro-LED) display device includes a micro-LED and a substrate. The substrate has at least one first metal layer. The micro-LED includes a light emitting structure, at least one second metal layer, at least one reflective layer, and a dielectric layer having an opening. The second metal layer forms a eutectic system or soldering contact with the first metal layer. The reflective layer is disposed between the light emitting structure and the second metal layer, and a eutectic point of the eutectic system or soldering point is lower than a melting point of the reflective layer. The dielectric layer is disposed between the light emitting layer and the reflective layer. 마이크로-발광 다이오드(마이크로-LED) 디스플레이 장치는 마이크로-LED 및 기판을 포함한다. 상기 기판은 적어도 하나의 제 1 금속층을 갖는다. 상기 마이크로-LED는 발광 구조체, 적어도 하나의 제 2 금속층, 적어도 하나의 반사층, 및 개구부를 갖는 유전체층(dielectric layer)을 포함한다. 상기 제 2 금속층은 상기 제 1 금속층과 공융계(eutectic system) 또는 납땜 접촉을 형성한다. 상기 반사층은 상기 발광 구조체 및 상기 제 2 금속층 사이에 배치되며, 상기 공융계 또는 납땜 지점의 공융 지점(eutectic point)은 반사층의 녹는점보다 낮다. 유전체층은 상기 발광층 및 반사층 사이에 배치된다.</abstract><oa>free_for_read</oa></addata></record>
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COMPUTING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
PHYSICS
title TOUCH PANEL AND FABRICATION METHOD THEREOF
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