TOUCH PANEL AND FABRICATION METHOD THEREOF

Provided are a touch panel and fabrication method thereof, capable of reducing a fabrication yield of the touch panel. A micro-light emitting diode (micro-LED) display device includes a micro-LED and a substrate. The substrate has at least one first metal layer. The micro-LED includes a light emitti...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	ZHUANYUAN ZHANG, YALU LIN, YUNCONG SU, YAN LIN, TSUNG KE CHIU
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	CALCULATING COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING PHYSICS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	Provided are a touch panel and fabrication method thereof, capable of reducing a fabrication yield of the touch panel. A micro-light emitting diode (micro-LED) display device includes a micro-LED and a substrate. The substrate has at least one first metal layer. The micro-LED includes a light emitting structure, at least one second metal layer, at least one reflective layer, and a dielectric layer having an opening. The second metal layer forms a eutectic system or soldering contact with the first metal layer. The reflective layer is disposed between the light emitting structure and the second metal layer, and a eutectic point of the eutectic system or soldering point is lower than a melting point of the reflective layer. The dielectric layer is disposed between the light emitting layer and the reflective layer. 마이크로-발광 다이오드(마이크로-LED) 디스플레이 장치는 마이크로-LED 및 기판을 포함한다. 상기 기판은 적어도 하나의 제 1 금속층을 갖는다. 상기 마이크로-LED는 발광 구조체, 적어도 하나의 제 2 금속층, 적어도 하나의 반사층, 및 개구부를 갖는 유전체층(dielectric layer)을 포함한다. 상기 제 2 금속층은 상기 제 1 금속층과 공융계(eutectic system) 또는 납땜 접촉을 형성한다. 상기 반사층은 상기 발광 구조체 및 상기 제 2 금속층 사이에 배치되며, 상기 공융계 또는 납땜 지점의 공융 지점(eutectic point)은 반사층의 녹는점보다 낮다. 유전체층은 상기 발광층 및 반사층 사이에 배치된다.