METHOD FOR A VARIETY METAL BONDING ON PRECIOUS METALS SPUTTERING TARGET DECREASE RAW MATERIALS AND THE SPUTTERING TARGET PREPARED THEREBY

The present invention relates to a sputtering target which reduces a usage of precious metal using a three-dimensional profile of a waste precious metal target used for a sputtering process, and a manufacturing method thereof. The manufacturing method of the sputtering target comprises: (i) a step o...

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Bibliographische Detailangaben
Hauptverfasser: KWON, OH JIB, YANG, SEUNG HO, YOON, WON KYU, HONG, GIL SOO
Format: Patent
Sprache:eng ; kor
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Zusammenfassung:The present invention relates to a sputtering target which reduces a usage of precious metal using a three-dimensional profile of a waste precious metal target used for a sputtering process, and a manufacturing method thereof. The manufacturing method of the sputtering target comprises: (i) a step of profiling a consumption part of a waste sputtering target in three-dimensional; (ii) a step of manufacturing a forming mold and a sintering mold; (iii) a step of filling the forming mold with precious metal powder to form a formed body; (iv) a step of pressing and heating the formed body to form a sintered body; and (v) a step of forming a first dissimilar metal layer on one surface of the sintered body, and flattening the other surface of the first dissimilar metal layer. 본 발명은 스퍼터링 공정에 사용된 귀금속 폐타겟의 3차원 프로파일을 이용하여, 귀금속 사용량이 저감된 스퍼터링 타겟 및 그 제조방법에 관한 것이다.