PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

A printed circuit board of the present invention comprises: a substrate having a product mounting area on which a device is mounted, and a non-mounting area; and a concave groove unit formed in an insulating layer of the non-mounting area. The printed circuit board can reduce a blistered defect by a...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	KIM, JUN YOUNG, KANG, JUNG KYU, RYU, JOUNG GUL
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	A printed circuit board of the present invention comprises: a substrate having a product mounting area on which a device is mounted, and a non-mounting area; and a concave groove unit formed in an insulating layer of the non-mounting area. The printed circuit board can reduce a blistered defect by a micro void generated between the insulating layer and a chemical copper interface, or a gassing trap generated between drying processes by forming the concave groove unit in the insulating layer. 본 발명의 인쇄회로기판은, 소자가 실장되는 제품 실장 영역과 비실장 영역을 갖는 기판; 및 상기 비실장 영역의 절연층에 형성된 요홈부를 포함한다.