HOT MELT PRESSURE SENSITIVE ADHESIVE AND THERMOSET COMPRISING STYRENE-BUTADIENE POLYMERS HAVING HIGH VINYL AND HIGH DI-BLOCK

본 발명은 약 5 내지 약 50 wt%의 블록 공중합체, 약 0 내지 약 75wt%의 점착화 수지, 약 0 내지 약 45wt%의 오일 및 약 0 내지 약 3wt%의 산화방지제를 함유하는, 고온 용융 감압 접착제 및 열경화재에 대한 방법 및 시스템을 제공한다. The present invention provides methods and systems for a hot melt pressure sensitive adhesive and thermoset that comprises from about 5 to about 50 wt. % o...

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Bibliographische Detailangaben
1. Verfasser:	GILLEN JASON
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	본 발명은 약 5 내지 약 50 wt%의 블록 공중합체, 약 0 내지 약 75wt%의 점착화 수지, 약 0 내지 약 45wt%의 오일 및 약 0 내지 약 3wt%의 산화방지제를 함유하는, 고온 용융 감압 접착제 및 열경화재에 대한 방법 및 시스템을 제공한다. The present invention provides methods and systems for a hot melt pressure sensitive adhesive and thermoset that comprises from about 5 to about 50 wt. % of a block copolymer, from about 0 to about 75 wt. % of a tackifying resin, from about 0 to about 45 wt. % of an oil, and from about 0 to about 3 wt. % of an antioxidant.