ROLLED COPPER FOIL, COPPER-CLAD LAMINATE, PRINTED WIRING BOARD AND ELECTRONIC DEVICE USING THE SAME, METHOD FOR PRODUCING CIRCUIT CONNECTING MEMBER, AND CIRCUIT CONNECTING MEMBER

The present invention provides a rolled copper foil, a copper-clad laminate board, and a printed wiring board having excellent etching, flexibility, adhesion with a resin, and transparency of the resin after removing a copper foil with etching. The rolled copper foil includes copper over 99.9% and h...

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Bibliographische Detailangaben
Hauptverfasser:	ARAI HIDETA, ARAI KOHSUKE, NAKAMURO KAICHIRO, MIKI ATSUSHI, AOSHIMA KAZUTAKA, KAMMURI KAZUKI
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	APPARATUS THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PERFORMING OPERATIONS PRINTED CIRCUITS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS TRANSPORTING
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Beschreibung
Zusammenfassung:	The present invention provides a rolled copper foil, a copper-clad laminate board, and a printed wiring board having excellent etching, flexibility, adhesion with a resin, and transparency of the resin after removing a copper foil with etching. The rolled copper foil includes copper over 99.9% and has a plating layer formed on a single surface or both surfaces. When an x-ray diffraction intensity calculated from a {112} surface in a rolled surface is I{112} and an x-ray intensity calculated from a {110} surface is I{110}, a formula(2.5