IMPROVED CHAMBER CLEANING WHEN USING ACID CHEMISTRIES TO FABRICATE MICROELECTRONIC DEVICES AND PRECURSORS THEREOF

본 발명은 산성 케미스트리들로 처리되는 웨이퍼 표면들 상의 오염을 감소시키는 처리 정책들을 제공한다. 정책들은 민감성 마이크로전자 피쳐들 또는 그 전구체들을 포함하는 것들을 포함하는, 광범위한 웨이퍼들과 함께 사용하기에 적합하다. 이들 정책들은 오염의 원인일 수 있는, 다른 프로세싱 챔버 표면들로부터 뿐 아니라 워크피스(들)의 전면으로부터의 잔여 산 및 산성 부산물들을 빠르고 효과적으로 제거하는 중성화 및 린싱 정책들의 결합을 수반한다. The present invention provides treatment strategies t...

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Hauptverfasser: BERG ERIK R, SIEFERING KEVIN L
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SIEFERING KEVIN L
description 본 발명은 산성 케미스트리들로 처리되는 웨이퍼 표면들 상의 오염을 감소시키는 처리 정책들을 제공한다. 정책들은 민감성 마이크로전자 피쳐들 또는 그 전구체들을 포함하는 것들을 포함하는, 광범위한 웨이퍼들과 함께 사용하기에 적합하다. 이들 정책들은 오염의 원인일 수 있는, 다른 프로세싱 챔버 표면들로부터 뿐 아니라 워크피스(들)의 전면으로부터의 잔여 산 및 산성 부산물들을 빠르고 효과적으로 제거하는 중성화 및 린싱 정책들의 결합을 수반한다. The present invention provides treatment strategies that reduce contamination on wafer surfaces that are treated with acid chemistries. The strategies are suitable for use with a wide variety of wafers, including those including sensitive microelectronic features or precursors thereof. These strategies involve a combination of neutralizing and rinsing strategies that quickly and effectively remove residual acid and acid by-products from both the front side of workpiece(s) as well as from other processing chamber surfaces that can be causes of contamination.
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The present invention provides treatment strategies that reduce contamination on wafer surfaces that are treated with acid chemistries. The strategies are suitable for use with a wide variety of wafers, including those including sensitive microelectronic features or precursors thereof. 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The present invention provides treatment strategies that reduce contamination on wafer surfaces that are treated with acid chemistries. The strategies are suitable for use with a wide variety of wafers, including those including sensitive microelectronic features or precursors thereof. 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The present invention provides treatment strategies that reduce contamination on wafer surfaces that are treated with acid chemistries. The strategies are suitable for use with a wide variety of wafers, including those including sensitive microelectronic features or precursors thereof. These strategies involve a combination of neutralizing and rinsing strategies that quickly and effectively remove residual acid and acid by-products from both the front side of workpiece(s) as well as from other processing chamber surfaces that can be causes of contamination.</abstract><oa>free_for_read</oa></addata></record>
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language eng ; kor
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subjects ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES
BASIC ELECTRIC ELEMENTS
CANDLES
CHEMISTRY
CLEANING
CLEANING IN GENERAL
DETERGENT COMPOSITIONS
DETERGENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FATTY ACIDS THEREFROM
METALLURGY
PERFORMING OPERATIONS
PREVENTION OF FOULING IN GENERAL
RECOVERY OF GLYCEROL
RESIN SOAPS
SEMICONDUCTOR DEVICES
SOAP OR SOAP-MAKING
TRANSPORTING
USE OF SINGLE SUBSTANCES AS DETERGENTS
title IMPROVED CHAMBER CLEANING WHEN USING ACID CHEMISTRIES TO FABRICATE MICROELECTRONIC DEVICES AND PRECURSORS THEREOF
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