THERMAL PROCESSING SYSTEM

An embodiment of the present invention relates to a heat treatment system which can mount and heat treat a maximum number of substrates for display devices in a minimum space. The heat treatment system comprises: a plurality of support columns; a substrate support composed of a cantilever supporting...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KIM, HUN SUNG, SEO, JI WON, JANG, JONG IL, SEO, BO IK, KWON, MUN HO, KWON, OH SUNG, KIM, HYUN SOO
Format: Patent
Sprache:eng ; kor
Schlagworte:
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