ELECTRONIC DEVICE MODULE AND METHOD THEREOF

An electronic device module according to an embodiment of the present invention may include a first substrate which has a double-sided mounting electrode, a plurality of first electronic components mounted on one surface of the first substrate, a second substrates which is bonded to the other surfac...

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Bibliographische Detailangaben
1. Verfasser:	RYU, MYUNG LIM
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGYGENERATION, TRANSMISSION OR DISTRIBUTION SEMICONDUCTOR DEVICES TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE
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Beschreibung
Zusammenfassung:	An electronic device module according to an embodiment of the present invention may include a first substrate which has a double-sided mounting electrode, a plurality of first electronic components mounted on one surface of the first substrate, a second substrates which is bonded to the other surface of the first substrate to form a cavity, a third substrate which is bonded to the other side of the first substrate and divides the cavity into multiple regions, and a plurality of second electronic components which are arranged on the divided regions and are mounted on the other side of the first substrate. So, the generation of cracks in a soldering can be prevented. 본 발명의 일 실시예에 따른 전자 부품 모듈은, 양면 실장용 전극이 형성되는 제1 기판, 상기 제1 기판의 어느 일면에 실장되는 복수의 제1 전자 부품, 상기 제1 기판의 타면에 접합되어 캐비티를 형성하는 제2 기판, 상기 제1 기판의 타면에 접합되며, 상기 캐비티를 복수의 영역으로 분할하는 제3 기판 및 상기 분할된 영역에 배치되며, 상기 제1 기판의 타면에 실장되는 복수의 제2 전자 부품을 포함할 수 있다.