CUTTING DEVICE FOR LIGHT GUIDE PLATE

The present invention relates to a cutting device for cutting a light guide plate and, more specifically, to a cutting device for cutting a light guide plate, which can increase irradiation efficiency of light by improving intensity of illumination (roughness) of a light entrance unit in which light...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	JUNG, BONG SOO, HA, SU YUNG
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	CUTTING CUTTING-OUT DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING,CUTTING-OUT, STAMPING-OUT OR SEVERING DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING FREQUENCY-CHANGING HAND CUTTING TOOLS NON-LINEAR OPTICS OPTICAL ANALOGUE/DIGITAL CONVERTERS OPTICAL LOGIC ELEMENTS OPTICS PERFORATING PERFORMING OPERATIONS PHYSICS PUNCHING SEVERING SEVERING BY MEANS OTHER THAN CUTTING STAMPING-OUT TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF TRANSPORTING
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Beschreibung
Zusammenfassung:	The present invention relates to a cutting device for cutting a light guide plate and, more specifically, to a cutting device for cutting a light guide plate, which can increase irradiation efficiency of light by improving intensity of illumination (roughness) of a light entrance unit in which light is irradiated from a light source. According to the present invention, the cutting device for cutting a light guide plate comprises a cutter unit and a cutting frame. 본 발명은 도광판 절단용 커팅 장치에 관한 것으로, 더욱 상세하게는 광원으로부터 광이 출사되는 입광부의 조도(거칠기)를 향상시켜 광의 출사 효율을 높일 수 있는 도광판 절단용 커팅 장치에 관한 것이다.