CPU PACKAGE SUBSTRATES WITH REMOVABLE MEMORY MECHANICAL INTERFACES

A configurable central processing unit (CPU) package substrate is disclosed. The package substrate including a processing device interface is described. The package substrate also includes a memory device electrical interface arranged on the package substrate. The package substrate also includes a r...

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Hauptverfasser:	THIBADO JONATHAN W, HOLDEN THOMAS T, SWAMINATHAN RAJASEKARAN, PRAKASH MANI, LLAPITAN DAVID J, LIU KUANG C, ZHANG ZHICHAO, GANESAN SANKA, COURY BASSAM N, ZIAKAS DIMITRIOS, LYNCH JOHN M, VERGIS GEORGE, MURTAGIAN GREGORIO R, SMALLEY JEFFORY L, ZHAO CHONG J, LI XIANG, VISWANATH RAM S
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION ORPROCESSING OF GOODS CURRENT COLLECTORS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS INFORMATION STORAGE LINE CONNECTORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PHYSICS PRINTED CIRCUITS SEMICONDUCTOR DEVICES STATIC STORES TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE
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Beschreibung
Zusammenfassung:	A configurable central processing unit (CPU) package substrate is disclosed. The package substrate including a processing device interface is described. The package substrate also includes a memory device electrical interface arranged on the package substrate. The package substrate also includes a removable memory mechanical interface arranged proximately to the memory device electrical interface. The removable memory mechanical interface is to allow a memory device to be easily removed from the package substrate after attachment of the memory device to the package substrate. 구성 가능 중앙 처리 유닛(CPU) 패키지 기판들이 개시된다. 처리 장치 인터페이스를 포함하는 패키지 기판이 설명된다. 패키지 기판은 패키지 기판 상에 배치된 메모리 장치 전기 인터페이스도 포함한다. 패키지 기판은 메모리 장치 전기 인터페이스에 근접 배치된 제거 가능 메모리 기계 인터페이스도 포함한다. 제거 가능 메모리 기계 인터페이스는 패키지 기판에 대한 메모리 장치의 부착 후에 메모리 장치가 패키지 기판으로부터 쉽게 제거되는 것을 가능하게 한다.