THE THERMAL INTERFACE MATERIAL AND PRODUCTION METHOD THEREOF

The present invention relates to a producing method of a thermal interface material comprising: a thermal conductive filler; a polymer matrix having elasticity and coated on the filler; and an insulation coating layer coated on a side surface of the filler and the matrix. The producing method of the...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	CHU, IN CHANG, JEON, YOON CHEOL, PARK, HYUN DAL, KIM, GYUNG BOK, LEE, SEUNG JAE, LYO, IN WOONG
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOUNDS THEREOF ELECTRICITY INORGANIC CHEMISTRY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY NON-METALLIC ELEMENTS PERFORMING OPERATIONS PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSIONOF CHEMICAL INTO ELECTRICAL ENERGY TRANSPORTING
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Beschreibung
Zusammenfassung:	The present invention relates to a producing method of a thermal interface material comprising: a thermal conductive filler; a polymer matrix having elasticity and coated on the filler; and an insulation coating layer coated on a side surface of the filler and the matrix. The producing method of the thermal interface material comprises the following steps of: extruding a material constituting the filler in a flat plate shape in a state that the material is dissolved; and coating the matrix on the flat plate shaped-filler. The thermal interface material of the present invention has a property of a high thermal radiation (maximum thermal conductivity of 20W/mK), compared to a conventional thermal interface material (maximum thermal conductivity of 5W/mK), thereby having an advantage of freely changing the thickness thereof when produced. 본 발명은 열계면 소재 제작방법에 관한 것으로, 열전도성 필러와, 탄성력을 가지며 필러에 도포된 고분자 매트릭스와, 필러와 매트릭스 측면에 도포된 절연코팅층을 포함하는 열계면 소재 제작방법에 있어서, 필러를 이루는 물질이 용해된 상태에서 판막 형태로 압출되는 단계 및, 판막 상태의 필러에 매트릭스가 코팅되는 단계를 포함하며, 종래 열계면 소재(열전도도 최대 5W/mK)와 대비하여 고방열 열계면 소재(열전도도 최대 20W/mK)로써 제작 두께를 자유롭게 할 수 있는 효과가 있는 열계면 소재 제작방법을 제공한다.