PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

The present invention relates to a printed circuit board and a method for manufacturing the same. The printed circuit board according to the present invention includes an insulating layer, a circuit layer which is formed on the insulating layer and comprises a pad and a circuit pattern, and a solder...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	HONG, MYEONG HO, KIM, JONG YONG, LEE, CHANG BO, YEO, JEONG HO
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	The present invention relates to a printed circuit board and a method for manufacturing the same. The printed circuit board according to the present invention includes an insulating layer, a circuit layer which is formed on the insulating layer and comprises a pad and a circuit pattern, and a solder resist layer which is stacked on the insulating layer, has an opening for exposing part of the pad, has one opening wall of the opening located on the pad, and the other opening wall located on the outside of the pad. So, the lifting of solder resist can be prevented. 본 발명은 인쇄회로기판 및 그 제조방법에 관한 것이다. 본 발명에 따른 인쇄회로기판은, 절연층과, 상기 절연층 상에 형성되며, 패드와 회로 패턴으로 구성된 회로층과, 상기 절연층 상에 적층되며, 상기 패드의 일부분이 노출되는 개구가 형성되어 상기 개구의 일측 개구벽이 상기 패드 상에 위치하고, 타측 개구벽이 상기 패드의 외측에 위치하는 솔더 레지스트층을 포함한다.